The Intel High-Speed Mezzanine Card (HSMC) specification allows for a flexible design approach to interoperable motherboards and mezzanine cards of various manufacturers. By defining both the electrical and mechanical properties of the adapter, HSMC brings a standardized approach to a modular architecture. HSMC Cable Assemblies can connect two carrier cards together for debugging, or extend the reach between a carrier card and daughter card for application-specific test environments.

The HSMC interconnect is based on Samtec’s High-Speed Q Strip^® Mezzanine Connectors and Cable Assemblies. The marriage of the 0.50 mm pitch connector with a 30 AWG twinax cable for longer reaches, or with a 38 AWG micro coax cable for high position count single-ended systems, provides a high density advantage ideal for Intel’s HSMC specification.

HSMC High-Speed Cable & Mezzanine Connectors allow users to connect two mainboards with HSMC interfaces. Terasic’s DE2-115 and DE4 host boards are shown.

System designers can use the new Xilinx^® characterization kit to evaluate high-speed interfaces integrated in the Zynq^® UltraScale+^™ Gen 2 RFSoC.

All ADCs, DACs and transceivers are accessible through Samtec’s Bulls Eye^® High-Performance Test Point System.

Engineers can attach the kit to custom baluns and test equipment for testing custom applications.

Samtec’s Bulls Eye^® high-performance test assemblies enable smaller evaluation boards and shorter trace lengths. A compression interface to the board provides for easy on/off as well as elimination of soldering costs.