Ultra Micro
Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. Ultra fine pitch, ultra-low profile and ultra-slim body connectors with 28+ Gbps performance.
Micro Blade & BeamMicro Blade & Beam Ultra Fine Pitch Connectors
0.40 mm and 0.50 mm pitch Micro Blade & Beam ultra slim, ultra low profile connectors.
Features
- Ultra fine pitch – 0.40 mm and 0.50 mm
- Ultra low stack down to 2.00 mm
- Slim body design for increased board space savings
Edge Rate®Edge Rate® Connector Strips
Rugged Edge Rate® contact systems optimized for signal integrity performance.
Features
- Edge Rate® contacts optimized for signal integrity performance
- 1.5 mm contact wipe
- Robust when "zippered" during unmating
- Up to 56 Gbps PAM4 performance
- 0.50 mm, 0.635 mm or 0.80 mm pitch systems
- Stack heights from 5 mm to 18 mm
- Extremely slim 2.5 mm body width on 0.635 mm pitch system
- 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Razor Beam™Razor Beam™
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.
Features
- 0.50 mm, 0.635 mm or 0.80 mm pitch systems
- Razor Beam™ contacts for high-speed and fine-pitch systems
- Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
- Shielded option for EMI protection
- Self-mating connectors reduce inventory costs and can be interchanged for varying stack heights
- 10 stack height options from 5 mm to 12 mm
- Up to 100 contacts
- Parallel, perpendicular and coplanar systems
- Audible click when mated
- Lubricated option available
SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.
Features
- 0.80 mm (.0315") pitch grid
- 50% board space savings versus .050" (1.27 mm) pitch arrays
- 28 Gbps NRZ/56 Gbps PAM4 performance
- Rugged Edge Rate® contact system
- Up to 500 I/Os
- 7 mm and 10 mm stack heights
- Solder charge terminations for ease of processing
- Samtec 28+ Gbps Solution
- Final Inch® certified for Break Out Region trace routing recommendations
- Analog Over Array™ capable
LP Array™LP Array™ Low Profile Open-Pin-Field Arrays
Low profile open-pin-field arrays down to 4 mm stack height and up to 400 total I/Os.
Features
- 4 mm, 4.5 mm, 5 mm stack heights
- Up to 400 I/Os
- 4, 6 and 8 row designs
- .050" (1.27 mm) pitch
- Dual beam contact system
- Solder crimp termination for ease of processing
- 28 Gbps NRZ/56 Gbps PAM4 performance
- Analog Over Array™ capable
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