Micro Backplane Systems
Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. Micro backplane systems include high-speed edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects in a variety of pitch, orientation and termination.
Edge Rate®Edge Rate® Rugged, High-Speed High Cycle Connector Strips
Rugged Edge Rate® high speed, high cycle connector strips with contact systems optimized for signal integrity performance.
Features
- Edge Rate® contacts optimized for signal integrity performance
- 1.5 mm contact wipe
- Robust when "zippered" during unmating
- Up to 56 Gbps PAM4 performance
- 0.50 mm, 0.635 mm or 0.80 mm pitch systems
- Stack heights from 5 mm to 18 mm
- Extremely slim 2.5 mm body width on 0.635 mm pitch system
- 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
High-Speed 0.80 mm Pitch Edge Card ConnectorsGenerate® High-Speed 0.80 mm Pitch Edge Card Connectors
Generate® high-speed edge card connectors / sockets with rugged Edge Rate® contacts on a micro 0.80 mm pitch.
Features
- 56 Gbps PAM4 performance
- Rugged Edge Rate® contacts
- Card slot: 1.60 mm (.062")
- Single-ended and differential pairs
- Vertical, right-angle, edge mount
- Optional board locks and cable latching features
- Optional weld tab for mechanical strength
- RU8 system for elevated board stacking
1.00 mm Pitch High-Speed Edge Card1.00 mm Pitch High-Speed Edge Card
1.00 mm pitch high-speed edge card sockets with rugged Edge Rate® contacts and misalignment mitigation.
Features
- Performance to 14 GHz / 28 Gbps
- Rugged Edge Rate® contacts decrease crosstalk and increase cycle life
- 20 – 140 total pins
- Accepts .062" (1.60 mm) thick cards
- Optional weld tab and alignment pin
Micro Edge Card SystemsMicro Edge Card Systems
Micro pitch edge card sockets in a variety of centerlines and orientations.
Features
- Performance to 56 Gbps NRZ
- Solutions for .062" (1.60 mm), and .093" (2.36 mm) thick cards
- Choice of pitch: 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, 2.00 mm
- Available in surface mount and through-hole
- Vertical, right-angle, edge mount
Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.
Features
- Performance to 28 Gbps
- Rugged Edge Rate® contacts
- Integral ground/power plane
- Up to 156 positions
- Slim footprint (less than 5.00 mm wide)
Q Strip®Q Strip® High-Speed Interconnects
Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential
Features
- Performance: Up to 14.0 GHz /28 Gbps
- Integral ground/power plane
- Connector to connector retention options
- Vertical, perpendicular, and coplanar applications
- Contacts: Up to 180 I/Os
- Stack height: 5 mm - 25 mm
Q2™Q2™ Rugged/High-Speed Interconnects
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.
Features
- Performance to 25 Gbps NRZ
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
- Power combo option
- Contacts: Up to 208 I/Os
- Stack height: 10.00 mm - 16.00 mm
SEARAY™SEARAY™ High-Density Open-Pin-Field Arrays
These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.
Features
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- 56 Gbps PAM4 performance
- Up to 560 I/Os in open pin field design
- 1.27 mm (.050") pitch
- Rugged Edge Rate® contact system
- Can be "zippered" during mating/unmating
- Solder charge terminations for ease of processing
- Meets Extended Life Product™ (E.L.P.™) standards
- Analog Over Array™ capable
- 7 - 18.5 mm stack heights
- Vertical, right-angle, press-fit
- Elevated systems to 40 mm
- 85 ohm systems
- Standards: VITA 47, VITA 57.1 FMC, VITA 57.4 FMC+, VITA 74 VNX, PISMO™ 2
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
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