Power/Signal Systems
High power and signal connectors. Combination board-to-board systems up to 60 A, in vertical and right-angle orientations with high-density power blades and small form factor designs.
Signal/Power Edge Rate® ComboSignal/Power Edge Rate® Combo Edge Card System
Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank.
Features
- Power blades rated up to 60 A per power bank
- Rugged Edge Rate® contact system
- Accepts 1.60mm (.062") thick cards
- Available with 40, 60 and 80 signal pins
- Choice of 2 or 4 power banks
- Optional weld tab for mechanical strength
Power / Q2™ Signal ComboPower / Q2™ Signal Combo
Q2™ power and signal combination interconnects with integral ground plane.
Features
- High-speed Q2™ contacts with power end option
- Vertical and right-angle orientations
- Up to 8 power pins per end as an application specific option
- Optional shielding
- Stack Height: 10.00 mm and 11.00 mm
- Contacts: Up to 156 signals, up to 4 power per end
PowerStrip™PowerStrip™
PowerStrip™/30 and PowerStrip™/40 combination signal and power systems.
Features
- Performance to 31.4 A per power blade
- Up to 8 power blades and 80 signal pins
- High-power dual blade contact system
- Rugged screw down and locking clip options
AcceleRate® mPAcceleRate® mP High-Density, High-Speed Power/Signal Arrays
These 0.635 mm pitch power/signal arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for 22 Amps/blade and simplified breakout region (BOR). View the full line of AcceleRate® products.
Features
- Best in class density for power and signal
- Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding
- Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
- PCIe® 6.0/CXL® 3.1 capable
- Up to 22 Amps per power blade
- Open-pin-field for grounding and routing flexibility
- High-density multi-row design
- Low profile 5 mm stack height; up to 16 mm in development
- 4 or 8 total power blades; up to 10 in development
- 60 or 240 total signal positions; additional position counts in development
- 0.635 mm signal pitch
- Optional alignment pins and weld tabs for a secure connection to the board
- Polarized guide posts for blind mating
- View the full line of AcceleRate® products
EXTreme Ten60Power™EXTreme Ten60Power™
A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.
Features
- Performance to 60 A per power blade
- Rugged 10 mm low profile design (right-angle orientation)
- 3 or 5 signal rows in the same form factor
- Available with 0 to 40 signal pins
- Up to 20 total DC power blades or 12 total AC power blades
- AC-DC power combos and split power options available
- Press-fit tails option for ease of board termination (ET60S only)
- Modules can be configured to accommodate most any design
- For coplanar or perpendicular applications
- Hot plug option available
EXTreme LPHPower™EXTreme LPHPower™
High-power, low profile system.
Features
- Performance to 30 A per power blade
- Extremely low 7.50 mm profile (right-angle)
- Double stacked power blades for high-density
- Socket mates with standard .062" (1.60 mm) PCB card
ExaMAX®ExaMAX® High-Speed Backplane System
ExaMAX® high-speed backplane interconnects deliver 64 Gbps PAM4 (32 Gbps NRZ) electrical performance.
Features
- Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch
- PCIe® 6.0/CXL® 3.1 capable
- Allows designers to optimize density or minimize board layer count
- Two reliable points of contact, even when subjected to angled mating
- Meets Telcordia GR-1217 CORE specification
- Individual signal wafers with staggered differential pair design; 24 - 72 pairs (board connectors) and 16 - 96 pairs (cable assemblies)
- One-piece embossed ground structure on each signal wafer to reduce crosstalk
- Lowest mating force on the market: 0.36 N max per contact
- Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
- Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
- Stub free mating
- Press-fit termination
- Power and Guide Modules available
XCede® HDXCede® HD High-Density Backplane System
Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.
Features
- Small form factor provides significant space savings
- Modular design provides flexibility in applications
- High-performance system
- High-density backplane system – up to 84 differential pairs per linear inch
- 1.80 mm column pitch
- 3-, 4- and 6-pair designs
- 4, 6 or 8 columns
- 12 - 48 pairs
- Multiple signal/ground pin staging options
- Integrated power, guidance, keying and side walls available
- 85 Ω and 100 Ω options
- Three levels of sequencing enable hot plugging
- Cost-effective designs available for low-speed applications
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