High-Speed Backplane Systems
Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.
NovaRay®NovaRay® 112 Gbps PAM4 Micro Rugged Backplane System
NovaRay® Micro Rugged Backplane system combines ultra-high density with an offset footprint for optimal signal integrity performance to 112 Gbps PAM4.
Features
- Ultra-high density with up to 128 differential pairs in a single connector
- 56 Gbps NRZ/112 Gbps PAM4 performance per channel
- Supports blind mate applications
- Surface mount for better density and performance
- Offset footprint for optimum signal integrity
- Flyover® cable assembly in design
ExaMAX®ExaMAX® High-Speed Backplane System
ExaMAX® high-speed backplane interconnects deliver 64 Gbps PAM4 (32 Gbps NRZ) electrical performance.
Features
- Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch
- PCIe® 6.0/CXL® 3.1 capable
- Allows designers to optimize density or minimize board layer count
- Two reliable points of contact, even when subjected to angled mating
- Meets Telcordia GR-1217 CORE specification
- Individual signal wafers with staggered differential pair design; 24 - 72 pairs (board connectors) and 16 - 96 pairs (cable assemblies)
- One-piece embossed ground structure on each signal wafer to reduce crosstalk
- Lowest mating force on the market: 0.36 N max per contact
- Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
- Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
- Stub free mating
- Press-fit termination
- Power and Guide Modules available
XCede® HDXCede® HD High-Density Backplane System
Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.
Features
- Small form factor provides significant space savings
- Modular design provides flexibility in applications
- High-performance system
- High-density backplane system – up to 84 differential pairs per linear inch
- 1.80 mm column pitch
- 3-, 4- and 6-pair designs
- 4, 6 or 8 columns
- 12 - 48 pairs
- Multiple signal/ground pin staging options
- Integrated power, guidance, keying and side walls available
- 85 Ω and 100 Ω options
- Three levels of sequencing enable hot plugging
- Cost-effective designs available for low-speed applications
© 2024 Samtec. All rights reserved.
Your Privacy Choices