AcceleRate® mP High-Density, High-Speed Power/Signal Arrays

AcceleRate® mP High-Density, High-Speed Power/Signal Arrays

These 0.635 mm pitch power/signal arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for 22 Amps/blade and simplified breakout region (BOR).


FEATURES

  • Best in class density for power and signal
  • Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding
  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
  • PCIe® 6.0 capable
  • Up to 22 Amps per power blade
  • Open-pin-field design for routing and grounding flexibility
  • High-density multi-row design
  • Low profile 5 mm stack height; up to 16 mm in development
  • 4 or 8 total power blades; up to 10 in development
  • 60 or 240 total signal positions; additional position counts in development
  • 0.635 mm signal pitch
  • Optional alignment pins and weld tabs for a secure connection to the board
  • Polarized guide posts for blind mating
  • View the full line of AcceleRate® products
UDX6
UDM6 Thermal Demo

AcceleRate® mP
(UDM6 Series)

Blades rotated 90° have equal access to heat escape for uniform cooling, increased current capacity, and reduced crowding.

DOWNLOADS & RESOURCES

Literature

Rugged/Power Interconnect Solutions Guide

Rugged/Power Interconnect Solutions Guide

Download PDF

Products

UDM6

IN DEVELOPMENT: 0.635 mm AcceleRate® mP High-Density, High-Speed Power/Signal Terminal

Features
  • 0.635 mm signal pitch
  • 2 or 4 power blades per row (2 rows)
  • Rotated power blades improve performance and simplify breakout region (BOR)
  • 10 or 40 signal positions per row (6 rows)
  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
  • PCIe® 6.0/CXL® 3.1 capable
  • Low profile 5 mm stack height; up to 16 mm in development
  • Alignment pins, weld tabs and polarized guide posts
  • View the full line of AcceleRate® products
IN DEVELOPMENT: 0.635 mm AcceleRate® mP High-Density, High-Speed Power/Signal Terminal

UDF6

IN DEVELOPMENT: 0.635 mm AcceleRate® mP High-Density, High-Speed Power/Signal Socket

Features
  • 0.635 mm signal pitch
  • 2 or 4 power blades per row (2 rows)
  • Rotated power blades improve performance and simplify breakout region (BOR)
  • 10 or 40 signal positions per row (6 rows)
  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
  • PCIe® 6.0/CXL® 3.1 capable
  • Low profile 5 mm stack height; up to 16 mm in development
  • Alignment pins, weld tabs and polarized guide posts
  • View the full line of AcceleRate® products
IN DEVELOPMENT: 0.635 mm AcceleRate® mP High-Density, High-Speed Power/Signal Socket

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