As data rates increase, trace lengths on PCBs decrease. Samtec's high-speed, Flyover® solutions simplify PCB design and limit signal degradation in high data rate applications. The Si-Fly™ Flyover® SI Evaluation Kit provides system designers and SI engineers an easy-to-use solution for testing the Si-Fly™ 112 Gbps PAM4, Low-Profile High-Density Cable System.

The Si-Fly™ Flyover® SI Evaluation Kit (REF-224260-X.XX-XXX) routes eight high-speed differential pairs through Precision RF connectors, a Copper Si-Fly™ Cable System and a Copper Si-Fly™ High-Density Interconnect.

The Si-Fly™ Flyover® SI Evaluation Kit delivers a high-quality system with robust mechanical design. Please contact Samtec’s technical experts at [email protected] for additional information.

• Two PCB system with compact form factor
• Each PCB contains one CPI series (CPI-16-01-2-S-RA-2-L-XX) Si-Fly™ Low-Profile, High-Density Interconnect
• PCBs connect via one of two Copper Si-Fly™ Low-Profile, High-Density Cable Systems (CPC-16-X-XX.X-2-02-L-X)
• Kits comes with two CPC series standard cable lengths (6”, 12”)
• Routes high-speed differential pairs (8) from CPI series connectors to high-precision RF connectors
• Supports multiple high-precision RF connector options
• Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
• Enable time domain measurements via direct connection to TDR/TDTs
• Enable frequency domain measurements via direct connection to VNAs