Next-generation data center equipment requires high-speed data paths across the backplane. Samtec’s ExaMAX^® high-speed backplane interconnects deliver 56 Gbps electrical performance. The ExaMAX^® Backplane SI Evaluation Kit provides system designers and SI engineers an easy-to-use solution for testing the ExaMAX^® High-Speed Backplane System.

The ExaMAX^® Backplane SI Evaluation Kit (REF-205463-01) consists of one ExaMAX^® SI Backplane (REF-200839-01) and two ExaMAX^® SI Linecards (REF-200840-01). The system routes eight, high-precision differential pairs over a backplane using ExaMAX^® connectors in a 4x10 configuration. It supports configurable backplane trace lengths via user-selected paddleboard placement. Users can configure the system with additional ExaMAX^® SI Linecards as desired.

The ExaMAX^® Backplane SI Evaluation Kit delivers a high-quality system with robust mechanical design. Please contact Samtec’s technical experts at [email protected] for additional information.

• Three piece PCB system in a compact form factor
• ExaMAX^® SI Backplane contains EBTM product ExaMAX^® 2.00 mm Pitch Vertical Header Assembly
• ExaMAX^® SI Linecard contains EBTF-RA product ExaMAX^® 2.00 mm Pitch Right-Angle Receptacle
• Configurable trace lengths from 0.75” to 20.5”
• Contains high-precision 2.92 mm RF connectors
• Optimized SI performance via Samtec Final Inch^® BOR PCB trace routing
• Enable time domain measurements via direct connection to TDR/TDTs
• Enable frequency domain measurements via direct connection to VNAs
• Ideal test platform for evaluation of 56 Gbps PAM4 CDRs, retimers, transceivers and similar ICs

Please see drawings REF-205463-01, REF-200839-01 and REF-200840-01 for more detail.

Contact [email protected] for additional ordering information.