Contact System
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Two reliable points of contact
- Even when subjected to angled mating
- Meets Telecordia GR-1217 CORE specification
- 2.4 mm mating surface area (contact wipe)
- Minimizes residual stub
- Clear separation between contact points
- Lowest mating force on the market
- Excellent contact normal force
Wafer Design
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Individual signal wafers
- Staggered, differential pair design
- 24-72 pairs
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Ground Plane
- One-piece, embossed ground structure
- Increased isolation significantly reduces crosstalk
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Ground signal placement engineered for 92Ω impedance
- Addresses both 85 and 100Ω applications
- Balanced differential pairs are arranged in columns with zero skew
Stub-Free Mating
- Fully protected terminals on both backplane and daughtercard connectors ensure stub-free mating
- Hermaphroditic mating interface provides reliable mating, protects pins
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