Webinar: Deep Dive into PCB Characteristics for Correlation/Simulation at 224G and Below

Presenters: Robert Branson and Greylan Smoak Deep Dive into PCB Characteristics for Correlation/Simulation at 224G and Below This discussion will look at techniques for simulating high-accuracy PCB structures to achieve accurate correlation for 224G performance. This topic is based on the work from our DesignCon paper, and will likewise look at modeling techniques that do not require the building of a test coupon. Test coupons, or relying on past data to understand a stack-up, is extremely useful data when available and should be used, but isn’t always an option due to the time and expenses that go into procuring that data. Instead, this topic will look at more general methods that can take general data from data sheets and get a reasonably accurate model from them. The goal is to build a good starting point for SI modeling of PCB structures, so that starting correlation can be achieved prior to manufacturing variation. From there, data on the stackup could be substituted in for the generic modelling approaches to further improve models on particular stackups over time.