Cable-On-Substrate
Samtec is the first to achieve a direct-to-chip package solution with the industry’s highest density 112 Gbps PAM4 interconnect.
The AcceleRate® HP cable-on-substrate solution provides greater design flexibility with the cable assembly plugging directly into the connector on the chip package, or transition board. Signals are routed directly from the chip through the cable, eliminating PCB routing for improved signal integrity, greater signal reach and simplified design.
Ideal for AI, high-performance computing (HPC) and data center applications.
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